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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging... Full description

1st Person: Liu, Yong
Additional Corporate Bodies: SpringerLink (Online service)
Additional Persons: SpringerLink (Online service)
Type of Publication: Book
Published: New York, NY Springer New York 2012, 2012
Keywords: Spectroscopy and Microscopy
Solid State Physics
Electronics and Microelectronics, Instrumentation
Engineering
Power Electronics, Electrical Machines and Networks
Spectroscopy
Circuits and Systems
Electronic circuits
Electronics
Microscopy
Microelectronics
Power electronics
Solid state physics
Online: Volltext
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